Part Number Hot Search : 
AP130 D5668 D74LVC AN1127 OM7671NM MM3ZC12V SD213 FDU1250
Product Description
Full Text Search
 

To Download FDD9407L-F085 Datasheet File

  If you can't view the Datasheet, Please click here to try to view without PDF Reader .  
 
 


  Datasheet File OCR Text:
  fdd9407l fdd9407_f085 d-pak(to-252) 13? 12mm 2500 units fdd9407_f085 n-channel power trench ? mosfet features ? typ r ds(on) = 1.6m at v gs = 10v, i d = 80a ? typ q g(tot) = 86nc at v gs = 10v, i d = 80a ? uis capability ? rohs compliant ? qualified to aec q101 applications ? automotive engine control ? powertrain management ? solenoid and motor drivers ? electronic steering ? integrated starter/alternator ? distributed power architectures and vrm ? primary switch for 12v systems mosfet maximum ratings t j = 25c unless otherwise noted symbol parameter ratings units v dss drain to source voltage 40 v v gs gate to source voltage 20 v i d drain current - continuous (v gs =10) (note 1) t c = 25c 100 a pulsed drain current t c = 25c see figure4 e as single pulse avalanche energy (note 2) 171 mj p d power dissipation 227 w derate above 25 o c1.52w/ o c t j , t stg operating and storage temperature -55 to + 175 o c r jc thermal resistance junction to case 0.66 o c/w r ja maximum thermal resistance junction to ambient (note 3) 52 o c/w package marking and ordering information device marking device package reel size tape width quantity notes: 1: current is limited by bondwire configuration. 2: starting t j = 25c, l = 0.08mh, i as = 64a, v dd = 40v during inductor charging and v dd = 0v during time in avalanche 3: r ja is the sum of the junction-to-case and case-to-ambient thermal re sistance where the case thermal reference is defined as the s older mounting surface of the drain pins. r jc is guaranteed by design while r ja is determined by the user's board design. the maximum rating presented here is based on mounting on a 1 in 2 pad of 2oz copper. d g s g s d to-252 d-pak (to-252) fdd9407l - f085 n-channel logic le vel powertrench ? mos fet 40 v, 100 a, 1.7 m ?2018 on semiconductor components industries, llc. publication order number: FDD9407L-F085 1 february-2018,rev.1 (vietnam)
fdd9407_f085 n-channel power trench ? mosfet 2 electrical characteristics t j = 25c unless otherwise noted off characteristics on characteristics dynamic characteristics symbol parameter test conditions min typ max units b vdss drain to source breakdown voltage i d = 250 a, v gs = 0v 40 - - v i dss drain to source leakage current v ds = 4 0 v , t j = 25 o c --1 a v gs = 0v t j = 175 o c(note 4) - - 1 ma i gss gate to source leakage current v gs = 20v - - 100 na v gs(th) gate to source threshold voltage v gs = v ds , i d = 250 a 2.0 3.1 4.0 v r ds(on) drain to source on resistance i d = 80a, v gs = 10v t j = 25 o c -1.62m t j = 175 o c(note 4) - 2.64 3.22 m c iss input capacitance v ds = 25v, v gs = 0v, f = 1mhz - 6390 - pf c oss output capacitance - 1580 - pf c rss reverse transfer capacitance - 95 - pf r g gate resistance f = 1mhz - 2.3 - q g(tot) total gate charge at 10v v gs = 0 to 10v v dd = 32v i d = 80a -86112nc q g(th) threshold gate charge v gs = 0 to 2v - 12 15.6 nc q gs gate to source gate charge -30-nc q gd gate to drain ?miller? charge - 15 - nc switching characteristics drain-source diode characteristics notes: 4: the maximum value is specified by design at tj = 175c. product is not tested to this condition in production. t on turn-on time v dd = 20v, i d = 80a, v gs = 10v, r gen = 6 - - 120 ns t d(on) turn-on delay time - 27 - ns t r rise time - 48 - ns t d(off) turn-off delay time - 42 - ns t f fall time - 18 - ns t off turn-off time - - 97 ns v sd source to drain diode voltage i sd = 80a, v gs = 0v - - 1.25 v i sd = 40a, v gs = 0v - - 1.2 v t rr reverse recovery time i f = 80a, di sd /dt = 100a/ s, v dd =32v -5888ns q rr reverse recovery charge - 83 143 nc february-2018,rev.1 (vietnam)
fdd9407_f085 n-channel power trench ? mosfet 3 typical characteristics figure 1. normalized po wer dissipation vs case temperature 0 25 50 75 100 125 150 175 0.0 0.2 0.4 0.6 0.8 1.0 1.2 power dissipation multiplier t c , case temperature( o c) figure 2. maximum continuous drain current vs case temperature 25 50 75 100 125 150 175 200 0 50 100 150 200 250 300 current limited by silicon current limited by package v gs = 10v i d , drain current (a) t c , case temperature( o c) figure 3. 10 -5 10 -4 10 -3 10 -2 10 -1 10 0 10 1 0.01 0.1 1 single pulse d = 0.50 0.20 0.10 0.05 0.02 0.01 normalized thermal impedance, z t jc t, rectangular pulse duration(s) duty cycle - descending order 2 notes: duty factor: d = t 1 /t 2 peak t j = p dm x z t ja x r t ja + t c p dm t 1 t 2 normalized maximum transient thermal impedance figure 4. peak current capability 10 -5 10 -4 10 -3 10 -2 10 -1 10 0 10 1 1 10 100 1000 v gs = 10v single pulse i dm , peak current (a) t, rectangular pulse duration(s) t c = 25 o c i = i 2 175 - t c 150 for temperatures above 25 o c derate peak current as follows: february-2018,rev.1 (vietnam)
fdd9407_f085 n-channel power trench ? mosfet 4 figure 5. 11 01 0 0 0.1 1 10 100 1000 100us 1ms 10ms i d , drain current (a) v ds , drain to source voltage (v) operation in this area may be limited by r ds(on) single pulse t j = max rated t c = 25 o c 100ms forward bias safe operating area 1e-3 0.01 0.1 1 10 100 1000 1 10 100 1000 starting t j = 150 o c starting t j = 25 o c i as , avalanche current (a) t av , time in avalanche (ms) t av = (l)(i as )/(1.3*rated bv dss - v dd ) if r = 0 if r z 0 t av = (l/r)ln[(i as *r)/(1.3*rated bv dss - v dd ) +1] note: refer to fairchild application notes an7514 and an7515 figure 6. unclamped inductive switching c apability figure 7. 34567 0 50 100 150 200 250 t j = -55 o c t j = 25 o c t j = 175 o c pulse duration = 80 p s duty cycle = 0.5% max v dd = 5v i d , drain current (a) v gs , gate to source voltage (v) transfer characteristics figure 8. 0.00.20.40.60.81.01.2 1 10 100 300 t j = 25 o c t j = 175 o c v gs = 0 v i s , reverse drain current (a) v sd , body diode forward voltage (v) forward diode characteristics figure 9. 012 0 50 100 150 200 250 5.5v v gs 15v top 10v 8v 7v 6v 5.5v bottom 80 p s pulse width tj=25 o c i d , drain current (a) v ds , drain to source voltage (v) saturation characteristics figure 10. 0.0 0.5 1.0 1.5 2.0 0 50 100 150 200 250 5.5v 5.5v i d , drain current (a) v ds , drain to source voltage (v) v gs 15v top 10v 8v 7v 6v 5.5v bottom 80 p s pulse width tj=175 o c saturation characteristics typical characteristics february-2018,rev.1 (vietnam)
fdd9407_f085 n-channel power trench ? mosfet 5 figure 11. 24681 0 0 6 12 18 24 30 i d = 80a pulse duration = 80 p s duty cycle = 0.5% max r ds(on) , drain to source on-resistance ( m : ) v gs , gate to source voltage (v) t j = 25 o c t j = 175 o c rdson vs gate voltage figure 12. normalized rdson vs junction te mperature -80 -40 0 40 80 120 160 200 0.6 0.8 1.0 1.2 1.4 1.6 1.8 pulse duration = 80 p s duty cycle = 0.5% max i d = 80a v gs = 10v normalized drain to source on-resistance t j , junction temperature ( o c ) figure 13. -80 -40 0 40 80 120 160 200 0.4 0.6 0.8 1.0 1.2 v gs = v ds i d = 250 p a normalized gate threshold voltage t j , junction temperature( o c) normalized gate threshold voltage vs temperature figure 14. -80 -40 0 40 80 120 160 200 0.8 0.9 1.0 1.1 1.2 i d = 1ma normalized drain to source breakdown voltage t j , junction temperature ( o c) normalized drain to source breakdown voltage vs junction temperature figure 15. 0.1 1 10 100 10 100 1000 10000 f = 1mhz v gs = 0v c rss c oss c iss capacitance (pf) v ds , drain to source voltage ( v ) capacitance vs drain to source voltage figure 16. 0 20406080100 0 2 4 6 8 10 i d = 80a v dd = 20v q g , gate charge(nc) v gs , gate to source voltage(v) gate charge vs gate to source voltage typical characteristics february-2018,rev.1 (vietnam)
? dimension l3/e1 is for reference only. notes millimeters inches dim. min. max. min. max. a 2.18 2.38 0.086 0.094 a1 - 0.127 - 0.005 b 0.64 0.88 0.025 0.035 b2 0.76 1.14 0.030 0.045 b3 4.95 5.46 0.195 0.215 c 0.46 0.61 0.018 0.024 c2 0.46 0.89 0.018 0.035 d 5.97 6.22 0.235 0.245 d1 4.10 - 0.161 - e 6.35 6.73 0.250 0.265 e1 4.32 - 0.170 - h 9.40 10.41 0.370 0.410 e 2.28 bsc 0.090 bsc e1 4.56 bsc 0.180 bsc l 1.40 1.78 0.055 0.070 l3 0.89 1.27 0.035 0.050 l4 - 1.02 - 0.040 l5 1.01 1.52 0.040 0.060 ? l3 d l4 l5 b b2 e1 e1 d1 c a1 gage plane height (0.5 mm) e b3 e c2 a l h d-pak to-252 6 february-2018,rev.1 (vietnam)
product speci?cation supersedes data of vietnam


▲Up To Search▲   

 
Price & Availability of FDD9407L-F085

All Rights Reserved © IC-ON-LINE 2003 - 2022  

[Add Bookmark] [Contact Us] [Link exchange] [Privacy policy]
Mirror Sites :  [www.datasheet.hk]   [www.maxim4u.com]  [www.ic-on-line.cn] [www.ic-on-line.com] [www.ic-on-line.net] [www.alldatasheet.com.cn] [www.gdcy.com]  [www.gdcy.net]


 . . . . .
  We use cookies to deliver the best possible web experience and assist with our advertising efforts. By continuing to use this site, you consent to the use of cookies. For more information on cookies, please take a look at our Privacy Policy. X